Intel to promote new panel technology at ultrabook ecosystem meeting in Taiwan

Monica Chen,Joseph Tsai, 27 July 2012

Intel has invited Taiwan-based ultrabook supply chain makers to attend an Ultrabook Ecosystem Symposium on July 31 in an attempt to propose various solutions to improve performance-cost ratios, with a focus on high-definition display panels and touch solutions including IGZO panels developed by Sharp and PenTile panels developed by Samsung Mobile Display, according to industry sources.

The sources pointed out that most first-tier notebook brand vendors including Hewlett-Packard (HP), Dell, Lenovo, Asustek Computer, Toshiba and Samsung Electronics have all launched ultrabooks based on Intel's Ivy Bridge platform, but their combined shipments are likely to be weaker than those of Apple's MacBook Air, and with the impact from Apple's iPad, the notebook brand vendors are currently struggling to achieve strong growth, pressing Intel to accelerate its development of next-generation ultrabook platforms.

In addition to the preparation of Haswell processors to achieve improvements in performance, system response, security and power consumption, touchscreen capabilities, high-definition panel designs and sensor devices for Windows 8 will also be topics that Intel will focus on at the meeting, while the company is also expected to bring out more suggestions for components such as chassis, batteries, hinges, and solid state drives (SSD) to realize ideal specifications, the sources noted.

The sources also pointed out that Navin Shenoy, ex-general manager of Intel Asia Pacific, will preside over the conference and will explain the current status of the ultrabook market as well as Intel's marketing strategy, and will also discuss with notebook brand vendors and component makers its future direction.

For panel-related components, during the conference, Sharp and Samsung are expected to explain the adoption of their technologies into third-generation ultrabooks, while backlight unit module maker Stanley Electric will also detail its latest backlight technology, and 3M will also make a keynote to address its low power display products.

As for SSDs, slim hard disk drives (HDD) and memory, Intel will provide details of non-volatile memory solutions, Micron and Sandisk will propose their latest SSD solutions, and Seagate and Western Digital will also detail their slim HDD products. Micron and SK Hynix will also provide DRAM and memory solutions, designed specifically for ultrabooks.

For cameras, sensors, GPS and voice functions, U-bolx, AzureWave, Realtek, Akusitica, InvenSense, ST Microelectronics, Capella and Sitronix are all expected to bring their latest solutions, with InvenSense to also explain the details of the next-generation motion interface industry, a direction that Intel is targeting for the future.

As for batteries, touch pads and keyboards, IMEC, Elan Microelectronics, Samsung SDI and Prologium, which focus on FPC lithium-ceramic batteries (FLCB), are expected to join the conference to explain their latest technologies, while Getac and Inhontech will further detail fiberglass- and carbon-fiber-reinforced plastic materials for chassis.

Ultrabook hinge topics will be handled by Shin Zu Shing (SZS) and Jarllytec, while Wistron NeWeb will detail antenna related topics.