Monica Chen, Jessie Shen, 14 September 2012
Intel has unveiled plans to transition to 14nm process technology
for the manufacture of CPUs and SoCs at the end of 2013, and begin R&D for
10nm and below processes on schedule from 2015.
Speaking at the Intel Developer Forum (IDF) in San Francisco,
company senior fellow Mark Bohr presented a roadmap demonstrating Intel's
continued leadership in semiconductor manufacturing process technology.
Intel disclosed that its upcoming 14nm process nodes – codenamed
P1272 and P1273 – are slated for production readiness by the end of 2013. The
vendor added it will continue pouring investment into its D1X fab in Oregon, Fab
42 in Arizona and Fab 24 in Ireland.
Intel previously confirmed that the three fabs are set for
investment for 14nm and below processes.
In addition, R&D for 10nm, 7nm and 5nm processes will kick off
on schedule starting 2015, Intel noted.
In May 2011, Intel announced its three-dimensional Tri-Gate
transistors, a breakthrough enabling chips to operate at lower voltage with
lower leakage while providing improved performance and energy efficiency
compared to previous transistors. The new transistors have been used in Ivy
Bridge-based Intel Core family processors with high-volume production starting
around the end of 2011.
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