Press
release; Jessie Shen, DIGITIMES [Friday 8 February
2013]
Micron
Technology and TE Connectivity have jointly announced the availability of a
single-sided SODIMM and a low-profile single-sided DDR3 SODIMM connector
solution to take advantage of the burgeoning market for ultrabook devices,
convertibles, tablets and other thin and light devices.
Aimed
at providing a reduced-height memory solution for the ultra-thin computing
market, the new single-sided SODIMM developed by Micron has components on either
the front or back side of the module, but not both. When paired with the
single-sided DDR3 SODIMM connector from TE, the total z-height of the overall
solution from the motherboard is just 3mm, a 35% savings compared to 4.6mm for a
standard SODIMM solution, the companies revealed.
Micron's single-sided SODIMM is available in a 4GB, single-rank, x8
configuration. In addition to a reduced height, this new module is built using
30nm DDR3L-RS components that consume less power in standby compared to standard
DDR3. Additionally, single-sided SODIMMs are pin-to-pin compatible with current
DDR3 modules, making them backward compatible with existing DDR3 SODIMM
connectors.
The
new single-sided DDR3 SODIMM connector, designed by TE engineers, delivers peak
performance with high-speed data applications, the companies disclosed. The
connector features a 35% reduction in height, compared with similar low-profile
connectors, which in turn, reduces the height of the end-product by 5-10%. It
also reduces motherboard shadow area by nearly 15mm-square, or 312mm-square for
common dual-socket implementation. The DDR3 SODIMM connector accepts modules
that meet JEDEC MO268 industry standards and is offered in both standard and
reverse types.
Single-sided SODIMM samples are available from Micron now, with mass
production scheduled for spring, 2013. Single-sided SODIMM connector samples are
also available from TE Connectivity, with mass production scheduled for June,
2013.
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